Intel is going all-in on the most expensive piece of equipment in semiconductor history. The chipmaker has adopted ASML’s next-generation High-NA EUV lithography system, a tool that costs roughly $400 million per unit, to power its future laptop chip production and broader processor roadmap.

The $400 million machine

High-NA EUV, which stands for high numerical aperture extreme ultraviolet lithography, is the latest leap in the ongoing miniaturization race. It uses incredibly precise light to draw circuit patterns at scales that eliminate the need for multiple patterning steps, which slow production and drive up defect rates.

Intel installed the industry’s first commercial High-NA EUV scanner, ASML’s TWINSCAN EXE:5000, at its Oregon R&D fab in April 2024. By late 2025, the company advanced to the more production-ready EXE:5200B model, which is expected to achieve throughput of over 175 wafers per hour.

ASML confirmed in February 2026 that its High-NA EUV tools are ready for high-volume manufacturing. The company reported processing 500,000 wafers with approximately 80% uptime, a benchmark that cleared the path for commercial deployment.

Intel’s process roadmap and the 14A node

Intel’s plan centers on its upcoming 14A process node, which is expected to leverage High-NA EUV for improved feature scaling across next-generation processors. Risk production using the 14A node is planned for 2027. Volume production is expected to start in 2028.

Intel has been collaborating with ASML on advanced lithography solutions since at least 2022, building institutional knowledge around these tools before competitors commit.

The competitive landscape

TSMC, Samsung, and SK Hynix are all potential adopters of High-NA EUV technology, but each has exercised restraint given the price tag and the uncertainty around production readiness. High-NA EUV supports Moore’s Law by enhancing resolution without requiring multiple patterning steps, which directly impacts transistor density and power efficiency.

ASML is the sole manufacturer of EUV lithography systems, and now High-NA EUV systems. Every advanced chipmaker on Earth depends on ASML’s machines.

What this means for investors

The tools are physically installed, processing wafers, and hitting throughput targets. Key dates to watch include any updates on risk production yields in 2027 and the transition to volume manufacturing in 2028.

Intel’s US-based fabs using the world’s most advanced lithography tools carry strategic significance beyond quarterly earnings. Governments across the US and Europe have signaled willingness to subsidize domestic chip production, and deploying High-NA EUV in Oregon rather than overseas strengthens Intel’s case for continued public support.

Full integration of High-NA EUV into production-scale chip manufacturing is anticipated within the next two to three years.