Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technology is emerging as a genuine competitive advantage in advanced chip packaging, a segment that’s becoming critical as AI workloads push the limits of what single chips can do.

Google, Amazon, and the rest of the lineup

Google is adopting Intel’s EMIB-T packaging for its 9th-generation TPU, codenamed “Humufish.” Google’s tensor processing units are the backbone of its AI infrastructure, and choosing Intel over TSMC’s CoWoS for packaging signals genuine technical confidence.

Google isn’t alone. Amazon, Cisco, SpaceX, and Tesla have all been confirmed as external customers for Intel’s packaging solutions. MediaTek announced its support for both TSMC CoWoS and Intel EMIB on May 29, 2026.

Intel’s EMIB and Foveros technologies are projected to generate billions in annual revenue.

Why packaging matters more than you think

Intel’s EMIB technology excels at 2.5D integration, connecting chiplets side by side on a single package with high-bandwidth bridges between them. Foveros adds 3D stacking capabilities, letting chips sit on top of each other.

TSMC’s CoWoS technology has been the industry standard for advanced packaging, particularly for Nvidia’s AI GPUs. CoWoS capacity has been sold out into 2025, even with ongoing expansion efforts.

TSMC’s response tells you everything

As of July 30, 2026, TSMC is reportedly developing an “EMIB-like” technology. TSMC’s capacity constraints have created an opening that Intel is exploiting effectively.

Intel is scaling its EMIB capacity globally, with production in both the US and Malaysia. MediaTek’s decision to support both platforms underscores a broader industry trend toward optionality in packaging providers.