Broadcom credit risk rises as AI financing commitments grow

Broadcom’s bond yields and credit-default swaps have climbed as the chipmaker considers guarantees for large AI financing packages.

Credit-risk measures tied to Broadcom have risen as the chipmaker backs increasingly large financing packages for artificial-intelligence infrastructure, Bloomberg reported.

Yields on Broadcom’s 5.15% bonds maturing in 2031 rose about 14 basis points in August, while five-year credit-default swaps climbed 28 basis points. The increases outpaced comparable moves for Oracle and SpaceX.

Broadcom is in talks to raise more than $60 billion in debt for an AI chip-financing deal expected to benefit Anthropic and other companies. Earlier this year, it helped backstop a $35 billion debt package for custom chips leased to Anthropic.

Investors are increasingly focused on guarantees and other forms of support that can place contingent obligations outside headline balance sheets. Analysts say those commitments could become costly if the AI investment cycle turns down.

Disclosure: This article was edited by Editorial Team. For more information on how we create and review content, see our Editorial Policy.

Credit-risk measures tied to Broadcom have risen as the chipmaker backs increasingly large financing packages for artificial-intelligence infrastructure, Bloomberg reported.

Disclosure: This article was edited by Editorial Team. For more information on how we create and review content, see our Editorial Policy.