Via trane.eu
Trane and Eaton separately advance power and cooling solutions for AI data centers
The two industrial giants are combining thermal management and power distribution expertise to tackle the enormous energy demands of AI infrastructure
Trane Technologies and Eaton Corporation have launched a joint power and cooling system designed specifically for AI data centers, aiming to improve energy efficiency and reduce costs.
Why AI data centers need a new playbook
Trane Technologies has built a deep portfolio in thermal management for hyperscale facilities, with coolant distribution units rated to handle up to 14 MW of liquid cooling capacity. Eaton, meanwhile, has been focused on the power side, developing high-voltage direct current (HVDC) infrastructure tailored for high-density GPU setups.
What each company brings to the table
Trane has been collaborating with NVIDIA, using the chipmaker’s Omniverse digital-twin modeling platform to refine its cooling designs. That partnership yielded nearly a 10% improvement in thermal performance for AI-driven workloads.
Trane also completed the acquisition of LiquidStack, a specialist in immersion and direct-to-chip cooling technologies.
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Eaton acquired Boyd Thermal for $9.5 billion, a deal that significantly bolstered its liquid cooling and thermal solutions portfolio. Eaton’s collaboration with NVIDIA on HVDC power infrastructure for dense GPU environments adds another dimension. HVDC systems eliminate the conversion losses that occur when alternating current gets stepped down and converted multiple times on its way to a server chip.